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ASML Holding N.V. (ASML) is a holding company, which operates through its subsidiaries. The Company is a provider of advanced technology systems for the semiconductor industry. It offers an integrated portfolio of lithography systems mainly for manufacturing complex integrated circuits (semiconductors, ICs or chips). The Company supplies lithography systems to IC manufacturers throughout Asia, the United States and Europe and also provides its customers with a range of support services from advanced process and product applications knowledge to complete round-the-clock service support. ASML’s wholly owned operating subsidiaries include ASML Netherlands B.V., ASML Hong Kong Limited and ASML IS, Inc. In July 2009, ASML introduced FlexRay programmable illumination and BaseLiner scanner matching technology, which offer scanner stability optimization and stabilize manufacturing process windows.

ATMI, Inc. was founded in 1986 and is headquartered in Danbury, Connecticut. ATMI, Inc. (ATMI) is a supplier of high performance materials, materials packaging and materials delivery systems used worldwide in the manufacture of microelectronics devices. The Company products consist of front-end semiconductor performance materials, sub-atmospheric pressure gas delivery systems for safe handling and delivery of toxic and hazardous gases to semiconductor process equipment, high-purity materials packaging and dispensing systems that allow for the reliable introduction of low volatility liquids and solids to microelectronics and biopharmaceutical processes. ATMI targets semiconductor and flat-panel display manufacturers, whose products form the foundation of microelectronics technology proliferating through the consumer products, information technology, automotive, healthcare and communications industries. ATMI serves three markets: integrated circuit (IC) fabrication, flat-panel displays and the life sciences market.

Aviza Technology, Inc. designs, manufactures, sells and supports semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. The Company’s systems are used in a variety of segments of the semiconductor market, including silicon processing for memory devices, advanced three-dimensional packaging and power integrated circuits for communications. It focuses on designing systems that enable device manufacturers to meet technological and manufacturing requirements. Aviza Technology, Inc. offers both front-end-of-line and back-end-of-line systems and process technologies used for the aforementioned markets addressing critical thin film formation technologies, including atomic layer deposition, physical vapor deposition, chemical vapor deposition, plasma etch and thermal processing systems. In June 2009, the Company and its subsidiaries filed a voluntary petition under Chapter 11 of the United States Bankruptcy Code.

Axcelis Technologies was founded in 1995 and is headquartered in Beverly, Massachusetts. Axcelis Technologies, Inc. (Axcelis) designs, manufactures and services ion implantation, dry strip and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, the Company provides aftermarket service and support, including spare parts, equipment upgrades, maintenance services and customer training. During the year ended December 31, 2008, the Company owned 50% of the equity of SEN Corporation (SEN), a producer of ion implantation equipment in Japan. SEN licenses technology from the Company for certain ion implantation products and has exclusive rights to market the licensed products in Japan. In February 2009, the Company entered into an agreement to sell its shares in SEN, which closed on March 30, 2009.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

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