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Semiconductor - Broad Line
Semiconductor - Integrated Circuits
Semiconductor - Memory Chips
Semiconductor - Specialized
Semiconductor Equipment & Materials

E.S.I. Environmental Sensors Inc.

E.S.I. Environmental Sensors Inc.

ESI is a leading developer and manufacturer of patented and proprietary systems for water management. ESI products has successfully been introduced into over 40 countries to manage irrigation systems, monitor water quality and the integrity of landfill covers and most recently in the oil and gas sector to measure the volumetric presence of water pumped from producing oil wells. Environmental managers and scientists have adopted ESI proprietary technology because of its accuracy, ease of use and ability to operate in challenging conditions. ESI is publicly traded on the TSX Venture Exchange under the symbol "ESV".

Nanosys, Inc.

Nanosys, Inc.

Nanosys develops nanomaterials for use in many different systems. These tiny structures are engineered on a nanometer scale. (To get an idea of how small a nanometer is, consider this: If a human hair were the width of the US, one nanometer would be as long as three railway locomotives.) Nanosys company's patented materials enable enhanced function in a variety of applications, including solar cells, biological sensors, flash memory devices, specialized coatings, and flexible electronics. Nanosys company's customers include Matsushita Electric Works, SAIC, and agencies of the US government.

Jetion Holdings Limited

Jetion Holdings Limited

Jetion Holdings company manufactures solar cells and modules -- parts used in solar power systems that convert sunlight into electricity. Its products are used by the power generation, defense, maritime, and transportation industries. With production facilities in China, Jetion is targeting its own fast-growing domestic solar power market, as well as export markets in Europe and North America, where demand is strong as solar applications become more sophisticated. Germany represents its largest customer base, accounting for more than half of the company's revenues. Bayerische Solar and Mage Solar are among Jetion's key customers.

Deva, Inc.

Deva, Inc.

Deva company distributes electronic components from Pacific Rim manufacturers, including discrete devices, power source assemblies, standard and custom cable assemblies, system cooling products, and display products. The company also offers engineering support, value analysis, kitting programs, and turnkey assembly programs. Deva has two locations, in California and Colorado, serving Southern California and the Rocky Mountain states.

Endress + Hauser Holding AG

Endress + Hauser Holding AG

Endress company makes instrumentation and measurement systems that monitor flow, pressure, and temperature. Customers use its equipment for various applications, including food, chemical, water, and petroleum production. Along with its products, the company offers consulting, training, and repair services. The company operates through more than 30 locations throughout the world. Three-fifths of sales are in Europe. Endress + Hauser was founded in 1953 by engineer Georg H. Endress and banker Ludwig Hauser. The Endress family has had sole ownership of the company since 1975. CEO Klaus Endress is the son of the co-founder.

STMicroelectronics NV

STMicroelectronics NV

STMicroelectronics NV was founded in 1987 and is headquartered in Geneva, Switzerland. STMicroelectronics N.V. is a global independent semiconductor company that designs, develops, manufactures and markets a range of semiconductor products used in a range of microelectronic applications, including automotive products, computer peripherals, telecommunications systems, consumer products, industrial automation and control systems. The products of the Company are manufactured and designed using a range of manufacturing processes and design methods. The Company uses all of the prevalent function-oriented process technologies, including complementary metal-on silicon oxide semiconductor (CMOS), bipolar and nonvolatile memory technologies. In addition, it has developed advanced systems-oriented technologies to produce differentiated and application-specific products, including bipolar CMOS technologies (BiCMOS) for mixed-signal applications, and diffused metal-on silicon oxide semiconductor (DMOS) technology and bipolar, CMOS and DMOS (BCD technologies).

Integrated Silicon Solution, Inc.

Integrated Silicon Solution, Inc.

Integrated Silicon Solution, Inc. was founded in 1988 and is headquartered in San Jose, California. Integrated Silicon Solution, Inc. (ISSI) is a fabless semiconductor company that designs and markets integrated circuits (ICs) for various markets, such as digital consumer electronics, networking, mobile communications, automotive electronics and industrial. The Company's primary products are high-speed and low-power static random access memory (SRAM), and low- and medium-density dynamic random access memory (DRAM). It also designs and markets application specific standard products (ASSP) primarily electrically erasable programmable ready only memory (EEPROMs) and SmartCards focused on its key markets. On April 27, 2009, the Company announced the acquisition of Enable Semiconductor Corporation.

Shanghai Hua Hong NEC Electronics Co., Ltd.

Shanghai Hua Hong NEC Electronics Co., Ltd.

Shanghai Hua Hong NEC Electronics Company, Ltd. manufactures semiconductors in Mainland China. It offers IC foundry services. It provides embedded non-volatile memory platforms in various applications, such as microprocessors, communications, consumer products, and smart cards, as well as offers design support, chip manufacturing, and testing services. The company also offers optional capacitors, high resistance poly resistors, and native transistors for designs. In addition, it provides mixed-signal analog CMOS platform that enables integration of less demanding RF circuit blocks with multi-million gate digital CMOS logic functions for wireless, multimedia, and PC products applications. Further, the company offers nvSOC prototype platform, which helps customers to create SOC and ASIC prototype, as well as used in the development of smartcard, MCU, USB Key, and other related products. Furthermore, it provides technology support and services, including various IP, foundry mainstream process design, layout, wafer sort, parametric test, reliability test, and failure analysis, as well as develops various after processes, including embedded non-volatile memories, HVCMOS, and RFCMOS. The company focuses on embedded NVM, LCD driver, analog/power management, RF technology field, and customer electronics.

ATMI, Inc.

ATMI, Inc.

ATMI, Inc. was founded in 1986 and is headquartered in Danbury, Connecticut. ATMI, Inc. (ATMI) is a supplier of high performance materials, materials packaging and materials delivery systems used worldwide in the manufacture of microelectronics devices. The Company products consist of front-end semiconductor performance materials, sub-atmospheric pressure gas delivery systems for safe handling and delivery of toxic and hazardous gases to semiconductor process equipment, high-purity materials packaging and dispensing systems that allow for the reliable introduction of low volatility liquids and solids to microelectronics and biopharmaceutical processes. ATMI targets semiconductor and flat-panel display manufacturers, whose products form the foundation of microelectronics technology proliferating through the consumer products, information technology, automotive, healthcare and communications industries. ATMI serves three markets: integrated circuit (IC) fabrication, flat-panel displays and the life sciences market.

ChipMOS TECHNOLOGIES (Bermuda) LTD.

ChipMOS TECHNOLOGIES (Bermuda) LTD.

ChipMOS TECHNOLOGIES (Bermuda) LTD.company was founded in 1986 and is based in Hsinchu, Taiwan. ChipMOS TECHNOLOGIES (Bermuda), LTD., together with its subsidiaries, provides testing and assembly services for liquid crystal display (LCD), and other flat-panel display driver semiconductors and advanced memory and mixed-signal products in Taiwan, Mainland China, Japan, Korea, Hong Kong, and the United States. It provides a range of back-end testing services for memory and mixed-signal semiconductors, which include engineering testing, wafer probing, laser repairing, burn-in testing, top marking, final testing, and final inspection and packing. The company's assembly services comprise wafer lapping, die saw, die attach, wire bonding, molding, marking, dejunking and trimming, electrical plating, ball mount and reflow, and forming/singulation. It also offers leadframe-based packages consisting of thin small outline packages and organic substrate-based packages, including fine-pitch ball grid array packages for memory and mixed-signal semiconductors; and gold bumping, testing, and assembly services for LCD and other flat-panel display driver semiconductors. In addition, the company provides memory module manufacturing; drop shipment services; and software engineering services, including test program development, conversion and optimization, related hardware design.

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