KLA-Tencor Corporation company was founded in 1975 and is headquartered in Milpitas, California. KLA-Tencor Corporation provides process control and yield management solutions for the semiconductor manufacturing and related microelectronics industries. It offers equipment comprising patterned and unpatterned wafer inspection, defect review, and classification; reticle defect inspection; packaging and interconnect inspection; critical dimension metrology; pattern overlay metrology; film thickness, surface topography, and composition measurement; measurement of in-chamber process conditions, wafer shape, and stress metrology; computational lithography tools; and yield and fab-wide data management and analysis solutions. The company also provides products that serve the LED, data storage, solar, and other industries; and semiconductor mask and wafer inspection and metrology systems. KLA-Tencor offers its products in the United States, Europe, Israel, Japan, Taiwan, Korea, and the Asia Pacific.

Integrated Device Technology, Inc. was founded in 1980 and is headquartered in San Jose, California. Integrated Device Technology, Inc. (IDT) designs, develops, manufactures and markets a range of semiconductor solutions for the advanced communications, computing and consumer industries. IDT provides a portfolio of semiconductor solutions, including integrated circuits that enable digital media to be transported, processed and delivered in communications, computing and consumer applications. During the fiscal year ended March 29, 2009, (fiscal 2009), the Company had five operating segments: Communications, Networking, Enterprise Computing, Computing and Multimedia, and Video and Display. During fiscal 2009, the Communications and Networking operating segments were aggregated into Communications segment, while Enterprise Computing, Computing and Multimedia, and Video and Display operating segments were aggregated into Computing and Consumer segment. On January 14, 2010, the Company announced that it has acquired Mobius Microsystems.

ReneSola Ltd. (ReneSola) is a manufacturer of solar wafers. As of December 31, 2008, ReneSola had 306 monocrystalline furnaces and 64 multicrystalline furnaces installed. As of December 31, 2008, it had annual wafer manufacturing capacity of approximately 645 megawatt, consisting of monocrystalline wafer manufacturing capacity of approximately 325 megawatt and multicrystalline wafer manufacturing capacity of approximately 320 megawatt. It offers monocrystalline wafers and multicrystalline wafers of various sizes and thicknesses. The Company is one of the wafer manufacturers in China capable of slicing wafers with a thickness less than 180 microns. It also offers ingot and wafer processing services to certain customers. In December 2008, ReneSola announced that it has sold its 49% interest in Linzhou Zhongsheng Semiconductor Silicon Material Co., Ltd. In May 2009, it acquired 100% equity interest of Wuxi Jiacheng Solar Energy Technology Co., Ltd (JC Solar).

United Microelectronics Corporation is engaged in the business of manufacturing or fabrication of semiconductors. Using the processes and techniques, the Company manufactures chips to the design specifications of the customers. The Company maintains a customer base across industries, including communication, consumer electronics, computer, memory and others. During the year ended December 31, 2008, the net wafer sales derived from the products used in communication devices, consumer electronics, personal computers (PCs), memory and other applications were 55.86%, 24.66%, 17.27%, 0.72% and 1.49% respectively.

Venture Corporation Ltd. is a Singapore-based company whose principal activities are to provide manufacturing, design, engineering, customization and logistic services to electronics companies worldwide. The Company’s market segments include the printing and imaging; retail store solutions and industrial products; computer peripherals and data storage, networking and communications, test and measurement, and medical electronics. Its subsidiaries include Advanced Products Corporation Pte Ltd, Cebelian Holdings Pte Ltd, Innovative Trek Technology Pte Lt, Technocom Systems Sdn Bhd, GES International Limited, Univac Precision Engineering Pte Ltd, Ventech Investments Ltd, Ventech Data Systems Pte Ltd and Multitech Systems Pte Ltd. On June 11, 2008, the Company, through its wholly owned subsidiary, GES Investment Pte Ltd, acquired the remaining 40% equity interest in its subsidiary, Scinetic Engineering Pte Ltd.

NEC TOKIN was founded in 1938 as Tohoku Metal Industries. NEC TOKIN Electronics makes tantalum capacitors, devices that store, filter, and regulate electricity and are found in nearly all electronic products. Its capacitors are particularly popular among automotive, telecom infrastructure, and consumer and medical electronics makers. NEC TOKIN also makes Lithium ion batteries, miniature relays, RFID tags, and electronic sensors. The company exports about 2.5 billion products annually to customers around the globe. Sales are supported by offices throughout Asia, as well as in France, Germany, Sweden, and the US.

APEM has become one of the leading worldwide manufacturers of man-machine interfaces. The group is present in 11 countries and has a network of more than 130 distributors and agents on five continents. With production plants in Europe, North Africa, America and Asia, APEM achieves 67 % of its turnover from export markets.APEM develops and manufactures professional switch products for diversified markets including instrumentation, medical, communications, industrial automation, defence and transport.

Nitronex Corporation was founded in 1999 and is headquartered in Durham, North Carolina. Nitronex Corporation develops and manufactures gallium nitride on silicon RF power transistors for wireless infrastructure, broadband, and military markets. It offers RF power, cellular RF, and broadband power transistors. The company's clients include top base station manufacturers.

Brandywine Communications is the premier supplier of precision GPS and time code based time and frequency products. Our product list includes plug-in cards for bus level timing such as PCI and VME cards, Network Time Servers (NTP Servers), GPS Frequency standards, GPS Master Clocks, Time and Frequency Systems, Time Displays and Time Code equipment.Brandywine offers custom products for the OEM market, GPS as well as SA-ASM GPS solutions for military applications. Our time and frequency standards with time code support a wide range of time code formats including IRIG B, IRIG A, IRIG G, and HaveQuick.Brandywine offers the industry's broadest range of solutions for customers requiring precise time and frequency.

PSC defines Thermal Solutions as all the components necessary to accomplish the cooling of an Integrated Circuit to a PCB to a Chassis to an entire Rack. PSC’s Thermal components are exhibited in detail within the pages of this website. The Thermal Components can be categorized as Air Moving Devices, Heat Sinks, and Heat Pipes; with the three components sometimes assembled together as one cooling unit.PSC has ownership in a Joint Venture factory located in Shajing, Shenzhen China. This factory is dedicated to manufacturing DC Motors and DC Air Moving devices designed by PSC’s China engineering team. The PSC China engineering, manufacturing and Asia sales team operate out of this China factory. One of the PSC founders lives full time in Shenzhen and manages the China operations. The company’s core engineering competence in China is focused on providing an alternate source to EBM’s DC Backward Curved Impeller product line and also engineering more advanced devices in this product venue. The company currently offers Backward Curved Impellers up to 310mm.PSC has been a major supplier to HP Compaq, IBM, ATI, Cisco Systems, Rockwell Automation, NCR, Bally Gaming Technologies and is currently working with APC( American Power Conversion, SGI, AllenVanguard, and many companies in Europe and mainland China itself. The PSC Thermal team is especially capable in the area of Engineering Design and Support. Our engineering has full Thermal simulation and test capability. It is the hope of PSC that this website becomes your “Thermal Bible”; it is all you need to solve your system’s Thermal challenges.

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