Elma Electronic is a global company that designs and manufactures solutions in electronics packaging. The company provides standard to fully customized components such as modular enclosures, cabinets and backplanes up to complete system integration. Elma also manufactures precision rotary switches. The company offers a fast, flexible response to customer needs and extensive practical knowledge in tailoring solutions to specific applications.Elma’s modular approach allows fast, cost-effective, and proven performance for customized design modifications to standard platforms. The base products are centered around 19” and 23” Eurocard specification, with creative design innovations for VME/ VME64x, CompactPCI/2.16, VXS/VPX, VXI/PXI, AdvancedTCA/MicroTCA and other architectures. The company’s design expertise allows fast implementation of full custom designs for backplanes, sub-racks, enclosures and cabinets, as well as full system integration.

Electrocomponents company's group of RS Components subsidiaries sells some 450,000 electronic, electrical, mechanical, and health and safety components, products, and tools. Through its well-known "RS Components" and "Radiospares" catalogs and CD-ROMs, dozens of Web sites, and trade counters (which offer free technical help), Electrocomponents reaches more than 1.6 million engineers and other customers worldwide. The company also offers same-day order processing, account management, and customized delivery services.

Sierra Monolithics, Inc. designs and manufactures analog and mixed signal integrated circuits for broadband wireless, optical communication, and microwave/millimeter wave applications. It offers wireless transceiver integrated circuits(IC), microwave transponders, millimeter wave ICs and modules, communication ICs, mixed signal, and RFIC custom designs. The company also provides custom integrated circuits and design services. Its products are used in wireless and wireline, and military applications. Sierra Monolithics, Inc. was founded in 1988 and is headquartered in Redondo Beach, California. As of December 9, 2009, Sierra Monolithics, Inc. operates as a subsidiary of Semtech Corp.

Electro-Matic Products, Inc. is a supplier of a complementary group of products, services and components targeting the users and manufacturers of industrial automation equipment and on-premise signage. It is our mission to provide our customer(s) technology solutions that will enhance their automation and other commercial environments. Customer driven value-added services are emphasized and include product selection assistance, application engineering, packaging design, training and support. Electro-Matic has grown with its customers, rapidly changing to meet new product requirements utilizing the most innovative technologies.

EnXnet, Inc. was founded in 1999 and is based in Tulsa, Oklahoma. EnXnet, Inc. engages in the development, marketing, and licensing of technologies for multimedia management products, solutions, and services. It offers DVDPlus, a dual sided hybrid optical disc media that combines two content storage formats for distribution on a single disc, a digital versatile disc (DVD) on one side and a compact disc (CD) on the other. DVDPlus allows content publishers to integrate their visual and audio assets into a single distribution. The company also provides ThinDisc, which is used as stored value cards that combine magnetic stripe and bar code data with optical media in CD and DVD format, or any other optical disc readable products; Disc Security Tag that utilizes electronic article surveillance tags embedded or adhered to a DVD or CD during the injection mold phase of the manufacturing process and provides product item identification to its customers and clients; and EnXcase, which is used in DVDPlus two-sided optical disc media market. In addition, it has a license to compile, use, copy, and modify ClearVideo Source Code for video/audio streaming over the Internet of TV type programming and content. The ClearVideo Technology enhances how video with synchronized audio files are transmitted over narrow and broadband lines; and is used for the compression and transmission of video files for the broadcast industry.

Cofidur offers contract electronics manufacturing, including design and production of printed circuit boards and electronic components. It specializes in multilayer and double-sided boards, along with electronic cards, and provides logistics services in addition to assembly of products. In late 2005 the company acquired a plant in Laval, France, from Flextronics International. Cofidur once made consumer electronics products, such as televisions, telephones, and PCs, primarily under the Continental Edison brand, but sold those product lines in 2002.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

Taiwan Semiconductor Manufacturing Company Ltd. was founded in 1987 and is headquartered in Hsinchu, Taiwan. Taiwan Semiconductor Manufacturing Company Limited (TSMC) is principally engaged in the manufacture of integrated circuits (ICs) for customers based on their own or third parties' IC designs. The Company offers a range of wafer fabrication processes, including embedded non-volatile memory process, embedded dynamic random access memory (DRAM) process, mixed signal/ radio frequency (RF) process, high voltage process, complementary metal-oxide semiconductor (CMOS) image sensor process, color filter process, micro electro-mechanical system (MEMS) process and silicon germanium process, among others. The Company's chips are used in computer products, communications products and consumer electronic products. As of December 31, 2008, the Company had seven wafer plants.

CPI International, Inc., through its subsidiaries, provides microwave, radio frequency, power, and control products primarily in the United States, Europe, and Asia. The company operates through two segments, VED and Satcom Equipment. The VED segment develops, manufactures, and distributes high power/high frequency microwave and radio frequency signal components. This segment's products include linear beam, cavity, power grid, crossed field, and magnetron devices. The Satcom Equipment segment manufactures and supplies high power amplifiers and networks for satellite communication uplink and industrial applications. This segment also offers spares, service, and other post sales support.CPI company's products are used for defense, communications, medical, scientific, and other applications to generate, amplify, transmit, and receive high-power microwave and RF signals, as well as to provide power and control for various applications. It distributes its products through its direct sales force and independent sales representatives, as well as through distributors. The company was formerly known as CPI Holdco, Inc. and changed its name to CPI International, Inc. in January 2006. CPI International, Inc. was founded in 1948 and is headquartered in Palo Alto, California.

Ascent Solar Technologies was founded in 1996 and is based in Thornton, Colorado. Ascent Solar Technologies, Inc., a development stage company, focuses on commercializing flexible photovoltaic (PV) modules using its proprietary technology. It intends to manufacture thin-film copper-indium-gallium-diselenide (CIGS) PV modules on plastic substrate. Ascent Solar Technologies thin-film PV technology is used for integrating solar power into various products and applications, including building integrated products (BIPV), electronic integrated and electronic portable power products (EIPV), defense, space, fabrics, and non-flat surfaces

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