Fuhrlander company makes and distributes wind turbines that produce from 30kW to 2.5 MW of electricity. Its products are also used to provide power for applications such as seawater desalination and air purification. Fuhrlander provides design, engineering, installation, maintenance, and repair services for its own and third-party systems. The company licenses its technologies and partners with distributors in the US, UK, and Vietnam. Fuhrlander has opened a manufacturing plant in China to serve a growing number of customers in the region -- including A-Power Energy -- and has announced plans to expand operations in the US by building a plant in Montana.

World Class Wire & Cable, Inc. company, which was formed by CEO James Lindenberg in 1994, is owned by global wiring and fasteners distributor Anixter International. World Class Wire & Cable, Inc. (WCWC) distributes electrical wire, cables, and tubing for everything from audio speakers to thermostats, spotlights to military tanks. It sells to wire distributors, electrical wholesalers, and wire harness manufacturers. WCWC also packs, hot stamps, inkjet prints, respools, strips, dyes, and coils wires, cables, and pipes. It offers warehousing, bar-coding, just-in-time delivery, and data processing services.

Mitsubishi Electric & Electronics USA projects big things in the US. The subsidiary of Mitsubishi Electric makes and markets a diverse line of consumer, commercial, and industrial electronics products. Mitsubishi Electric US's product lines include automation equipment (motion controllers, servo systems, and uninterruptible power supplies), automotive (electrical components), elevators and escalators, heating and air conditioning (air purifiers and compressors), home theater (audio-video systems and stadium displays), power products (air-, hydrogen-, and water-cooled generators, along with photovoltaic solar cells), semiconductors, and wireless communications devices.

Pacific Aerospace & Electronics company makes a proprietary range of metal, electronic, and ceramic seals and connectors used in harsh environments common to aerospace to defense, medical, and telecommunications industries. Its lineup specializes in light-weight hermetic protective packaging for electronics. Containers are used in buffering satellites in space, connectors for oil rig drilling, to cochlear implants for the hearing impaired. Military subcontracts with giants like Lockheed Martin and Boeing's noncommercial segment account for more than 60% of orders.

MediaTek Inc. is principally engaged in the design, research, development, manufacture and sale, as well as the testing and maintenance of multimedia chipsets. The Company offers optical storage chipsets, digital versatile disc (DVD) player single chip solutions, mobile communication equipment chipsets, Bluetooth and mobile phone peripheral chips, wireless local area network (WLAN) chips, digital television(TV) control chips, TV decoder/demodulator chipsets, global positioning system (GPS) receiver chips and digital camera control chips, among others. The Company's products are applied for personal computer systems, digital home appliances, mobile phones and digital televisions (TVs). During the year ended December 31, 2008, the Company obtained 98.91% of its total revenue from its multimedia chipset business.

Founded in 1999, Canesta, Inc. has received investments from Carlyle Growth Partners (an affiliate of The Carlyle Group), Hotung, and Venrock Associates. Canesta, Inc. company develops microchips and accompanying software that enable the input of data into wireless devices and other products using infrared technology. The system functions by transmitting light from a known source, which bounces off an object and back onto a sensor array chip. Its technology has been licensed for use in touch-free television controls made by Hitachi and automobile safety systems made by Honda. Canesta is also developing products for use in video game controllers and security systems.

FlipChip International, LLC provides merchant wafer level packaging and flip chip bumping services to the semiconductor industry. Its wafer level services include standard flip chip (SFC), redistributed SFC, Wafer UltraCSP, e-less nickel bumping WLCSP, Polymer Collar, and high frequency RF packaging; and die level services comprise dicing, optical inspection, pick-and-place, waffle-pak, tape and reel, wafer sawing, wafer probe, wafer sort, test, die trays, and ship direct of finished die to end customer. The company also performs services in various categories, which include product qualification, reliability testing, failure analysis, material characterization, and technical/expert reports. FlipChip International, LLC has strategic partnership with Semiconductor Manufacturing International Corporation. The company was incorporated in 2004 and is headquartered in Phoenix, Arizona. As of February 10, 2004, FlipChip International, LLC operates as a subsidiary of RoseStreet Labs LLC.

DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980, the Company designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. DALSA's core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.

Mindspeed Technologies, Inc. company was founded in 2001 and is headquartered in Newport Beach, California. Mindspeed Technologies, Inc. (Mindspeed) designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure. Its products are classified into three focused product families: multiservice access, high-performance analog and wide area networking communications. Multiservice access products include multi-core digital signal processor (DSP) system-on-a-chip (SoC) products for carrier-class, triple-play edge gateways, metro trunking gateways and other voice over Internet protocol (VoIP) and multi-play service platforms in the carrier infrastructure. The products are used in customer-premises equipment (CPE) gateways and other equipment that carriers are deploying in order to deliver voice, data and video services to residential subscribers. High performance analog products include equalization and signal-conditioning solutions for fiber access networks, including Ethernet passive optical networking (EPON) equipment.

Infiniti Solutions, Ltd. provides semiconductor test and assembly services. Its semiconductor services include packaging solutions, including package design and development, thermal and electrical modeling, process development, material selection, and system in a package; test solutions, such as design for test, test program development and conversion, test flow development, test time reduction, load board and probe card design, burn-in board design and fabrication, and burn-in systems; and prototyping, including device characterization, reliability services, product and package failure analysis, PCB assembly for development kit, and quick turn assembly. The company’s mass production services include wafer sort; assembly; test, including electrical test, burn-in, and environmental; failure analysis, such as parametric electrical test, real-time X-ray, optical and C-mode scanning acoustic microscopy, and SEM/EDX; reliability, including moisture sensitivity test, high temperature and temperature cycling treatment, HAST, solderability test, HTOL, and ESD; end of line services, such as laser marking, bake, scan, and tape and reel; warehousing and logistics, including packing, storage, and drop-shipment. It also designs and manufactures burn-in boards and systems, as well as printed circuit boards.

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