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NanoInk, Inc. engages in developing, manufacturing, and distributing nanometer-scale structures and applications for life science and semiconductor industries in North America, Europe, and the Middle East. It offers patterning systems; nanofabrication systems with integrated atomic force microscopy imaging; desktop nanofabrication systems; nanolithography platforms for desktop nanofabrication; research platform enabling Dip Pen Nanolithography (DPN); NanoStem biochips; curriculum-led projects for undergraduate education in nanotechnology; and nanotechnology curriculum and product programs. The company provides accessories and consumables, which include probes and pens, substrates, and inkwells and inks; accessories for DPN; and array-based instrument systems and contract research services for nanoscale protein detection and discovery. It also offers DPN instruments and nanofabrication systems for pharmaceutical customers, as well as provides installation, training, and custom application development services. The company’s products are used in protein assay applications, such as kinase profiling, auto-antibody detection, antibody specificity characterization, protein-protein interaction detection, and protein-small molecule interaction studies. It sells its products through distributors in the United States, Canada, Europe, China, Korea, Taiwan, Japan, Singapore, and India.

Nanosys develops nanomaterials for use in many different systems. These tiny structures are engineered on a nanometer scale. (To get an idea of how small a nanometer is, consider this: If a human hair were the width of the US, one nanometer would be as long as three railway locomotives.) Nanosys company's patented materials enable enhanced function in a variety of applications, including solar cells, biological sensors, flash memory devices, specialized coatings, and flexible electronics. Nanosys company's customers include Matsushita Electric Works, SAIC, and agencies of the US government.

At NDT Technologies, we don’t use the words “Research & Development” lightly. After all, our name says – and the core of our business is – Technology. Superior technology is easier to sell. Therefore, first-rate R&D is the foundation of our marketing and sales effort. Our technology is based on a thorough knowledge of physical principles. It wasn’t concocted based on a hunch, some vague intuition, and implemented by trial-and-error. We are pretty serious about things like engineering. And manufacturing. And physics. And mathematics.

NEXX Systems, Inc. engages in the design, manufacture, sale, installation, and servicing of semiconductor process equipment in the United States and internationally. It provides process solutions designed for semiconductor wafer level packaging. The company’s products comprise Apollo, a second-generation sputter deposition system; and Stratus, an electrochemical plating system. It serves semiconductor manufacturers, including outsourced assembly and test providers, and integrated device manufacturers. The company was founded in 2001 and is headquartered in Billerica, Massachusetts.

Novellus Systems, Inc. was founded in 1984 and is headquartered in San Jose, California. Novellus Systems, Inc., together with its subsidiaries, develops, manufactures, sells, and supports equipment used in the fabrication of integrated circuits. It operates in two segments, Semiconductor Group and Industrial Applications Group. The Semiconductor Group segment manufactures and supplies equipment used in the deposition of thin dielectric and metal films, as well as equipment used in complementary manufacturing steps, including surface preparation and ultraviolet thermal processing. Its deposition systems use chemical vapor deposition (CVD), physical vapor deposition (PVD), and electrochemical deposition (ECD) processes to form transistor, capacitor, and interconnect layers in an integrated circuit. This segment’s High-Density Plasma CVD (HDP-CVD) and Plasma-Enhanced CVD (PECVD) systems employ chemical plasma to deposit dielectric material within the gaps formed by the etching of aluminum, or as a blanket film that can be etched with patterns for depositing conductive materials into the etched dielectric. Its CVD Tungsten systems are used to deposit conductive contacts between transistors and interconnect; PVD systems are used to deposit conductive aluminum and copper metal layers by sputtering metal atoms from the surface of a target source; and Electrofil ECD systems are used to deposit copper to form the conductive wiring on integrated circuits using copper interconnects.

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