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FlipChip International, LLC provides merchant wafer level packaging and flip chip bumping services to the semiconductor industry. Its wafer level services include standard flip chip (SFC), redistributed SFC, Wafer UltraCSP, e-less nickel bumping WLCSP, Polymer Collar, and high frequency RF packaging; and die level services comprise dicing, optical inspection, pick-and-place, waffle-pak, tape and reel, wafer sawing, wafer probe, wafer sort, test, die trays, and ship direct of finished die to end customer. The company also performs services in various categories, which include product qualification, reliability testing, failure analysis, material characterization, and technical/expert reports. FlipChip International, LLC has strategic partnership with Semiconductor Manufacturing International Corporation. The company was incorporated in 2004 and is headquartered in Phoenix, Arizona. As of February 10, 2004, FlipChip International, LLC operates as a subsidiary of RoseStreet Labs LLC.

Fortrend makes equipment for storing and transporting photomasks in semiconductor manufacturing facilities. Photomasks, also known as masks or reticles, are the quartz lenses used in optical lithography machines to print circuits onto a silicon wafer. An advanced semiconductor design may call for dozens of masks, so safely handling those masks as they are moved from one lithography system to another is a priority for chip makers. Fortrend was established in 1979 as an engineering consulting firm, then shifted its focus to reticle automation equipment in 1989. The company had a change in management in 2002. Founder and former CEO John M. Rush is the majority shareholder.

FSI International, Inc. was founded in 1973 and is based in Chaska, Minnesota. FSI International, Inc. (FSI) designs, manufactures, markets and supports equipment used in the fabrication of microelectronics, such as advanced semiconductor devices. During the fiscal year ended August 29, 2009 (fiscal 2009), the Company provided surface conditioning technology solutions and microlithography systems and support services to worldwide manufacturers of integrated circuits. FSI manufactures, markets and supports surface conditioning equipment that uses wet, cryogenic and other chemistry techniques to clean, strip or etch the surfaces of silicon wafers and supplies refurbished microlithography products that are used to deposit and develop light sensitive films. FSI directly sells and services its products in North America, Europe, and the Asia Pacific region, except for Japan. In Japan, its products are sold and serviced through Apprecia Technology, Inc. (Apprecia), a company in which FSI maintains a 20% equity ownership.

Fujimi Incorporated company manufactures synthetic chemical abrasives and polishing compounds used by high-tech industries. Its products are used for cutting, shaping, and polishing optical lenses, hard drives, wafers and other semiconductors, as well as the quartz used in mobile devices. Fujimi Inc. also makes wire-saw slicing abrasives used for solar-powered batteries, thermal spray materials used for coating the abrasives, and the polishing compound used in chemical-mechanical polishing (CMP). Fujimi Inc was founded in 1950; US subsidiary Fujimi Corporation was established in 1984.

GCL Solar Energy Technology Holdings researches, develops, produces, and sells polysilicon, which is the fundamental raw material used to produce semiconductors and photovoltaic (PV) solar cells. Polysilicon is manufactured at GCL's production facility in the Jiangsu province of China. Chairman Zhu Gongshan is the company's controlling stockholder. Founded in 2006, GCL Solar Energy Technology filed to go public in 2008 but withdrew its registration statement a year later.

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