Esec AG

Esec (formerly Oerlikon Assembly Equipment) makes manufacturing equipment used to assemble finished semiconductors. Its core business is making the die bonders, wire bonders, and flip chip bonders needed to lay down the itty bitty pathways on microchips. The company also makes equipment for assembling components and the packaging technology for smart cards. Oerlikon merged the formerly publicly traded ESEC into its Assembly Equipment division in 2004. The company has seven service centers located strategically in select Asian markets, as well as in Europe and the US. In 2009 Oerlikon sold Oerlikon Esec to rival BE Semiconductor Industries in a stock-swap transaction.
Contact Details
Executives
Divisional Head
Kurt Trippacher
Global Communications Manager
Yvonne Huber