Axcelis Technologies was founded in 1995 and is headquartered in Beverly, Massachusetts. Axcelis Technologies, Inc. (Axcelis) designs, manufactures and services ion implantation, dry strip and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, the Company provides aftermarket service and support, including spare parts, equipment upgrades, maintenance services and customer training. During the year ended December 31, 2008, the Company owned 50% of the equity of SEN Corporation (SEN), a producer of ion implantation equipment in Japan. SEN licenses technology from the Company for certain ion implantation products and has exclusive rights to market the licensed products in Japan. In February 2009, the Company entered into an agreement to sell its shares in SEN, which closed on March 30, 2009.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

Brooks Automation Inc. company was founded in 1978 and is headquartered in Chelmsford, Massachusetts. Brooks Automation, Inc. (Brooks) is a provider of automation, vacuum and instrumentation solutions and is a business partner to original equipment manufacturers (OEM) and equipment users throughout the world. The Company also provides solutions to customers in data storage, advanced display, analytical instruments and solar markets. Brooks operates in three segments: Critical Solutions Group, Systems Solutions Group and Global Customer Operations. The Critical Solutions Group segment provides a variety of products critical to technology equipment productivity and availability. The Systems Solutions Group segment provides a range of products and engineering and manufacturing services. The Global Customer Operations segment provides a range of support services.

Brooks Automation Inc. company was founded in 1978 and is headquartered in Chelmsford, Massachusetts. Brooks Automation, Inc. (Brooks) is a provider of automation, vacuum and instrumentation solutions and is a business partner to original equipment manufacturers (OEM) and equipment users throughout the world. The Company also provides solutions to customers in data storage, advanced display, analytical instruments and solar markets. Brooks operates in three segments: Critical Solutions Group, Systems Solutions Group and Global Customer Operations. The Critical Solutions Group segment provides a variety of products critical to technology equipment productivity and availability. The Systems Solutions Group segment provides a range of products and engineering and manufacturing services. The Global Customer Operations segment provides a range of support services.

BTU International, Inc. was founded in 1950 and is headquartered in Billerica, Massachusetts. BTU International, Inc. (BTU) is a supplier of thermal processing equipment to the alternative energy and electronics manufacturing markets. BTU equipment and processes are used in the production of solar cells, nuclear fuel and fuel cells, as well as in printed circuit board assembly and semiconductor packaging. In the solar market, BTU offers processing equipment for both silicon and thin film photovoltaics. In thin film photovoltaics, BTU’s equipment is used for both the copper indium gallium selenide (CIGS) and cadmium telluride (CdTe) processes. Silicon photovoltaic applications are served by BTU’s metallization furnaces and in-line diffusion systems. Also in alternative energy, its customers use its thermal systems for the processing of nuclear fuel and the manufacturing of fuel cells. The Company’s convection solder reflow systems are used to attach electronic components to the printed circuit boards, primarily in the surface mount segments of this market.

Cabot Microelectronics Corporation was founded in 1999 and is headquartered in Aurora, Illinois. Cabot Microelectronics Corporation (Cabot Microelectronics) is a supplier of polishing slurries used in the manufacture of integrated circuit (IC) devices within the semiconductor industry, in a process called chemical mechanical planarization (CMP). CMP is a polishing process used by IC device manufacturers to planarize or flatten many of the multiple layers of material that are deposited upon silicon wafers in the production of ICs. It is engaged in the development, manufacture and sale of CMP consumables. It develops, produces and sells CMP slurries for polishing conducting and insulating materials used in IC devices, and also for polishing the disk substrates and magnetic heads used in hard disk drives. The Company also develops, manufactures and sells CMP polishing pads, which are used in conjunction with slurries in the CMP process. In February 2009, the Company completed its acquisition of Epoch Material Co., Ltd., a subsidiary of Eternal Chemical Co., Ltd.

China Resources Microelectronics Limited was founded in 1997 and is headquartered in Wuxi, China. China Resources Microelectronics Limited is a subsidiary of China Resources (Holdings) Company Limited. China Resources Microelectronics Limited, an investment holding company, engages in business investment, development, and operation management in high-tech microelectronics in Mainland China, Asia, the United States, and Europe. It offers discrete devices and analog integrated circuits (ICs). The company also provides open foundry, IC design, IC testing, and packaging services, as well as discrete device manufacturing services. In addition, it offers technical platforms, such as CMOS, BiCMOS, DMOS, BCD, Bipolar, MIXED-MODE, HVCMOS, MG, NVMEE/OTP, DMOS, and MEMS; discrete device wafers and finished products for energy saving lightings, home appliances, industrial control devices, and personal computers; and audio/video processing IC, MCU, mixed-signal IC, power management IC, and power IC. Further, the company provides turkey services, such as wafer testing, ultra-thin back grinding, packaging, products testing, evaluation, and reel packaging; and power transistor chips. China Resources Microelectronics Limited was formerly known as CSMC Technologies Corporation and changed its name to China Resources Microelectronics Limited in March 2008.

ChipMOS TECHNOLOGIES (Bermuda) LTD.company was founded in 1986 and is based in Hsinchu, Taiwan. ChipMOS TECHNOLOGIES (Bermuda), LTD., together with its subsidiaries, provides testing and assembly services for liquid crystal display (LCD), and other flat-panel display driver semiconductors and advanced memory and mixed-signal products in Taiwan, Mainland China, Japan, Korea, Hong Kong, and the United States. It provides a range of back-end testing services for memory and mixed-signal semiconductors, which include engineering testing, wafer probing, laser repairing, burn-in testing, top marking, final testing, and final inspection and packing. The company's assembly services comprise wafer lapping, die saw, die attach, wire bonding, molding, marking, dejunking and trimming, electrical plating, ball mount and reflow, and forming/singulation. It also offers leadframe-based packages consisting of thin small outline packages and organic substrate-based packages, including fine-pitch ball grid array packages for memory and mixed-signal semiconductors; and gold bumping, testing, and assembly services for LCD and other flat-panel display driver semiconductors. In addition, the company provides memory module manufacturing; drop shipment services; and software engineering services, including test program development, conversion and optimization, related hardware design.

CLEANPAK International, Inc. company was founded in 1938 and is based in Clackamas, Oregon. Cleanpak International, Inc. manufactures air handling units. It offers air handling equipment, ceiling systems, hood and booths, wall systems, and various accessories. The company, through its subsidiary, also designs and manufactures cleanroom components, laminar flow workstations, modulars, plastic systems, and walls and ceilings. Cleanpak International, Inc. serves life sciences, bio tech, medical device and industrial manufacturing, research and development, semiconductor, pharmaceutical, chemical, and aerospace industries and universities.

Cohu, Inc. (Cohu) is engaged in developing, manufacturing, marketing, sale and servicing of test handling and burn-in related equipment and thermal sub-systems for the global semiconductor industry. The Company has three segments: semiconductor equipment, television cameras, and microwave communications. The semiconductor equipment segment, operated under the Company’s wholly owned subsidiary Delta Design, Inc. (Delta), develops, manufactures and sells semiconductor test handling, burn-in related equipment and thermal sub-systems. The television camera segment (Electronics Division) designs, manufactures, and sells closed circuit television cameras and systems. The Company’s microwave communications segment, through Broadcast Microwave Services, Inc. (BMS), designs, manufactures, and sells microwave communications equipment. On December 9, 2008, the Company acquired Rasco GmbH.

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