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Lam Research Corporation company was founded in 1980 and is headquartered in Fremont, California. Lam Research Corporation engages in the design, manufacture, marketing, and service of semiconductor processing equipment used in the fabrication of integrated circuits. It offers etch products, including dielectric; conductor; micro-electromechanical systems and deep silicon; and three-dimensional integrated circuits, which are used in etching process. The company also provides single-wafer wet clean and plasma-based bevel clean systems, which are used in post-etch/post-strip cleaning and pre-diffusion/pre-deposition cleaning process. Lam Research Corporation sells its products and services primarily to companies involved in the production of semiconductors in the United States, Europe, Taiwan, Korea, Japan, and the Asia Pacific.

LightPath Technologies, Inc. was founded in 1985 and is headquartered in Orlando, Florida. LightPath Technologies, Inc. (LightPath) manufactures optical components and assemblies, including precision molded glass aspheric optics, precision molded infrared molded optics, isolators, fiber-optic collimators, GRADIUM glass lenses and other optical materials used to produce products that manipulate light. It designs, develops, manufactures and distributes optical components and assemblies utilizing advanced optical manufacturing processes. The Company’s products are used in a variety of applications in many industries, including defense products, medical devices, laser aided industrial tools, automotive safety applications, barcode scanners, optical data storage, hybrid fiber coax datacom, telecom, machine vision and sensors.

LTX-Credence Corporation company was founded in 1976 and is headquartered in Milpitas, California. LTX-Credence Corporation (LTX-Credence) provides focused, automated test equipment (ATE) solutions. The Company designs, manufactures, markets and service ATE solutions that address the divergent test requirements of the wireless, computing, automotive and digital consumer market segments. Semiconductor designers and manufacturers worldwide use its equipment to test their devices during the manufacturing process. After testing, these devices are then incorporated in a range of products, including computers, mobile Internet equipment, such as wireless access points and interfaces, broadband access products, such as cable modems and digital subscriber line (DSL) modem, personal communication products, such as cell phones and personal digital assistants, consumer products, such as televisions, digital cameras and automobile electronics, and for power management in portable and automotive electronics. On August 29, 2008, LTX Corporation and Credence Systems Corporation completed a merger.

MAPPER Lithography B.V. company has developed specialized lithography equipment used in semiconductor production. (MAPPER stands for "Multi-Aperture Pixel-by-Pixel Enhancement of Resolution," which is the name of the company's proprietary technology.) Lithography is a key process by which circuit patterns are inscribed into silicon wafers. The company has technology partnerships with Philips and Taiwan Semiconductor Manufacturing. The MAPPER technology grew out of research at the Delft University of Technology, and the company, established in 2000, makes its headquarters in the university's Applied Physics Laboratory.

Mattson Technology, Inc. was founded in 1988 and is headquartered in Fremont, California. Mattson Technology, Inc. (Mattson) is engaged in designing, manufacturing and marketing semiconductor wafer processing equipment used in the fabrication of integrated circuits (ICs or chips). Mattson is a supplier of dry strip and rapid thermal processing equipment to the global semiconductor industry. The Company’s customer base includes foundries, memory and logic device manufacturers. The Company has design and manufacturing centers in the United States, Canada and Germany. Mattson’s manufacturing equipment is used for transistor level, or front-end-of-line manufacturing, and also in specialized applications for processing the interconnect layer, or back-end-of-line processing. A strip system removes photoresist or other residues from a wafer following each step of film deposition or diffusion processing in preparation for the next processing step. Methods for stripping off these residues include wet and dry technologies.

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